- Capability group
- Semiconductors & Advanced Computing
- Domain
- Critical Technology · Hard Power
- Identifier
- factbase.org/cap/1W9YVWCN49
Papers
2.5k
2020–2024
Paper growth
−0%
2020–24 on 2015–19
Patent families
22.6k
2020–2024
Filed abroad
23%
families in more than one office
In the framework
What the capability covers and what it leaves to others, and the indicators it will be measured by.
Bounds
Covers design and design tooling; fabrication sits with the next capability, and design strength and tool dependence read at this capability's make and control layers respectively.
Lineage
New in v0.1, from the split of the v0.0 design-and-fabrication node (retired): design and fabrication are different national positions in the chain, held separately in practice, and a single node could not record that.
Indicators
- fabless design revenue sharePending
- design tool market positionPending
- chip design starts at advanced nodesPending
Research
Papers classified to the capability, by year and by the nation of their authors' institutions, 2020–2024. Read from the v0.0 research topic Advanced integrated circuit design and fabrication, which it shares with Advanced Semiconductor Fabrication.
Papers by year
The five leading nations, papers by year
Share of papers, 2020–2024
Of papers with a known author nation; 25% have none and are left out.
- 1China24.0%521 papers
- 2United States12.8%278 papers
- 3India10.7%232 papers
- 4Germany4.7%103 papers
- 5South Korea4.4%96 papers
- 6Japan3.7%81 papers
- 7Italy3.3%72 papers
- 8Taiwan3.3%71 papers
- 9United Kingdom2.8%61 papers
- 10Canada2.6%56 papers
Leading institutions, 2020–2024
By fractional count: each paper divided among its authors' institutions.
- 1University of Electronic Science and Technology of China42fractional papers
- 2Xidian University30fractional papers
- 3Southeast University29fractional papers
- 4Hangzhou Dianzi University17fractional papers
- 5National Yang Ming Chiao Tung University16fractional papers
- 6South China University of Technology15fractional papers
- 7Chinese Academy of Sciences13fractional papers
- 8Tianjin University12fractional papers
- 9Tsinghua University10fractional papers
- 10Beijing Institute of Technology9fractional papers
Patents
Patent families by the nation of origin of their applicants and their earliest priority year, from the CPC and IPC classes the capability is read from. 2025 onwards is incomplete: families are published 18 months after priority.
Families by priority year
The five leading origins, families by year
3,496 applicants filed here in 2015–2024; the five largest held 24% of families (HHI 181 of 10,000: unconcentrated).
Share of families by origin, 2020–2024
- 1China69.3%15,665 families
- 2United States12.2%2,755 families
- 3South Korea5.9%1,324 families
- 4Taiwan5.5%1,245 families
- 5Japan3.3%736 families
- 6Germany1.1%260 families
- 7United Kingdom0.6%125 families
- 8France0.3%57 families
- 9Netherlands0.2%56 families
- 10Singapore0.2%48 families
Applicants filing most internationally, 2015–2024
Families filed in more than one office, by applicant as the offices name them.
- 1TAIWAN SEMICONDUCTOR MFG CO LTD1,190international families
- 2SAMSUNG ELECTRONICS CO LTD1,068international families
- 3TAIWAN SEMICONDUCTOR MFG520international families
- 4INTEL CORP254international families
- 5SYNOPSYS INC191international families
- 6QUALCOMM INC178international families
- 7CHANGXIN MEMORY TECH INC148international families
- 8IBM147international families
- 9UNITED MICROELECTRONICS CORP137international families
- 10FUJITSU LTD132international families
Classification read
- G06F30/30 Circuit design automation: logic, layout, verification · 213.9k documents
- G06F2115/00 Circuit types addressed by design automation · 10.1k documents
- G06F2117/00 Aims of circuit design, e.g. low power, testability · 3.7k documents
- H10D89/10 Integrated circuit layouts · 44.2k documents
- H10D84/90 Gate arrays and standard-cell integrated circuits · 26.3k documents
Shares inventions with
Capabilities whose classes the same families also fall in, by overlap (Jaccard).
- Advanced Semiconductor Fabrication4,003 families · 0.028
- High-Performance & AI Computing478 families · 0.016
- Advanced Packaging & Heterogeneous Integration1,398 families · 0.015
- Quantum Computing177 families · 0.012
- Compound & Power Semiconductors340 families · 0.012
Companies
50 companies in this capability, across 8 regions. The leading 12:
- 1SynopsysLargest EDA and semiconductor IP vendor, covering synthesis, verification and the leading interface IP; it absorbed Ansys simulation in 2025.Software & services
- 2Cadence Design SystemsSecond of the big-three EDA vendors; it leads in custom/analog layout (Virtuoso), hardware emulation (Palladium) and digital implementation, and also sells IP.Software & services
- 3Siemens (Siemens EDA)Siemens EDA (formerly Mentor Graphics) is the third big-three EDA vendor; its Calibre physical verification is the de facto foundry signoff standard.Software & services
- 4NVIDIALargest fabless chip designer by revenue; it designs the GPU and AI accelerator families (Hopper, Blackwell) used in most AI data centres.Design
- 5Arm HoldingsLicenses the processor architecture and CPU/GPU IP cores inside nearly all smartphones and a growing share of data-centre and automotive chips.Design
- 6QualcommLeading fabless designer of mobile SoCs (Snapdragon) and cellular modems, and a major holder of wireless patents.Design
- 7BroadcomFabless leader in networking, switching and custom AI ASICs (XPUs) for hyperscalers such as Google's TPU.Design
- 8AMDFabless designer of x86 CPUs (EPYC, Ryzen), Instinct AI GPUs and, through Xilinx, FPGAs; it was an early leader in chiplet design.Design
- 9AppleDesigns its own A-series and M-series SoCs and modems in-house, and is usually first to market on TSMC's leading-edge nodes.Design
- 10MediaTekLargest fabless designer outside the US, supplying the most smartphone SoCs by volume (Dimensity) plus TV, Wi-Fi and ASIC chips.Design
- 11HuaweiHiSilicon is Huawei's chip-design arm and China's most advanced designer, covering Kirin phone SoCs and Ascend AI accelerators, built under US export controls.Design
- 12Marvell TechnologyFabless designer of data-infrastructure silicon (electro-optics DSPs, custom AI ASICs for AWS and Microsoft, storage controllers).Design