- Capability group
- Semiconductors & Advanced Computing
- Domain
- Critical Technology · Hard Power
- Identifier
- factbase.org/cap/WPY8136006
Papers
2.5k
2020–2024
Paper growth
−0%
2020–24 on 2015–19
Patent families
147.7k
2020–2024
Filed abroad
50%
families in more than one office
In the framework
What the capability covers and what it leaves to others, and the indicators it will be measured by.
Bounds
Covers process technology and fabrication capacity as capability; the fabrication plant as a facility belongs to Strategic Infrastructure's Production Systems, and mature-node capacity reads at the same layers with different weights.
Lineage
New in v0.1, from the split of the v0.0 design-and-fabrication node (retired), on the same logic: the capacity to fabricate is the scarcest position in the chain and warrants its own record.
Indicators
- leading-edge wafer capacity sharePending
- foundry revenue sharePending
- fab construction pipelinePending
Research
Papers classified to the capability, by year and by the nation of their authors' institutions, 2020–2024. Read from the v0.0 research topic Advanced integrated circuit design and fabrication, which it shares with Semiconductor Design & EDA.
Papers by year
The five leading nations, papers by year
Share of papers, 2020–2024
Of papers with a known author nation; 25% have none and are left out.
- 1China24.0%521 papers
- 2United States12.8%278 papers
- 3India10.7%232 papers
- 4Germany4.7%103 papers
- 5South Korea4.4%96 papers
- 6Japan3.7%81 papers
- 7Italy3.3%72 papers
- 8Taiwan3.3%71 papers
- 9United Kingdom2.8%61 papers
- 10Canada2.6%56 papers
Leading institutions, 2020–2024
By fractional count: each paper divided among its authors' institutions.
- 1University of Electronic Science and Technology of China42fractional papers
- 2Xidian University30fractional papers
- 3Southeast University29fractional papers
- 4Hangzhou Dianzi University17fractional papers
- 5National Yang Ming Chiao Tung University16fractional papers
- 6South China University of Technology15fractional papers
- 7Chinese Academy of Sciences13fractional papers
- 8Tianjin University12fractional papers
- 9Tsinghua University10fractional papers
- 10Beijing Institute of Technology9fractional papers
Patents
Patent families by the nation of origin of their applicants and their earliest priority year, from the CPC and IPC classes the capability is read from. 2025 onwards is incomplete: families are published 18 months after priority.
Families by priority year
The five leading origins, families by year
19,953 applicants filed here in 2015–2024; the five largest held 18% of families (HHI 101 of 10,000: unconcentrated).
Share of families by origin, 2020–2024
- 1China38.3%56,585 families
- 2Japan20.2%29,848 families
- 3South Korea12.7%18,787 families
- 4United States12.5%18,492 families
- 5Taiwan10.6%15,662 families
- 6Germany1.3%1,960 families
- 7Netherlands0.8%1,248 families
- 8France0.8%1,134 families
- 9Singapore0.7%966 families
- 10Switzerland0.3%463 families
Applicants filing most internationally, 2015–2024
Families filed in more than one office, by applicant as the offices name them.
- 1SAMSUNG ELECTRONICS CO LTD11,759international families
- 2TAIWAN SEMICONDUCTOR MFG CO LTD10,855international families
- 3TOKYO ELECTRON LTD5,910international families
- 4TAIWAN SEMICONDUCTOR MFG4,129international families
- 5APPLIED MATERIALS INC3,753international families
- 6INTEL CORP3,231international families
- 7KIOXIA CORP2,472international families
- 8SK HYNIX INC2,305international families
- 9BOE TECHNOLOGY GROUP CO LTD2,061international families
- 10DISCO CORP1,996international families
Classification read
- H10P Semiconductor manufacturing processes: deposition, etch, implant, lithography steps · 4m documents
- H10D30/01 Manufacture of field-effect transistors · 617.2k documents
- H10D30/62 FinFET transistors · 101.4k documents
- H10D30/501 Nanosheet and gate-all-around transistors · 34.4k documents
- H10D84/00 Integrated circuits on semiconductor wafers, e.g. CMOS · 1.1m documents
- H10D88/00 Three-dimensional integrated devices · 43.5k documents
- H10B Memory devices: DRAM, flash, resistive and magnetic memory · 1.1m documents
- H10W10/00 Isolation regions between components in chips · 285k documents
- H10W20/00 On-chip interconnections and through-silicon vias · 1.4m documents
Shares inventions with
Capabilities whose classes the same families also fall in, by overlap (Jaccard).
- Semiconductor Equipment & Materials47,125 families · 0.248
- Advanced Packaging & Heterogeneous Integration40,102 families · 0.216
- Compound & Power Semiconductors17,261 families · 0.121
- Nanomaterials & Metamaterials5,517 families · 0.034
- Semiconductor Design & EDA4,003 families · 0.028
Companies
50 companies in this capability, across 7 regions. The leading 12:
- 1TSMCLargest foundry in the world with about two-thirds of foundry revenue; first to volume production at 3nm and 2nm (N2).Manufacture
- 2Samsung ElectronicsRuns leading-edge logic (first gate-all-around 3nm) and the world's largest DRAM and NAND fabs; tops international patent filings in this capability.Manufacture
- 3ASMLSole supplier of EUV and High-NA EUV lithography scanners, without which no sub-7nm node can be made.Equipment & materials
- 4IntelThe only US-headquartered leading-edge logic manufacturer, ramping its 18A node with RibbonFET and backside power through Intel Foundry.Manufacture
- 5Applied MaterialsLargest wafer fab equipment maker by revenue, leading in deposition, etch, CMP, ion implant and e-beam inspection.Equipment & materials
- 6Tokyo ElectronDominant supplier of coater/developer tracks used with EUV, and a major supplier of etch, deposition and cleaning tools.Equipment & materials
- 7Lam ResearchMarket leader in plasma etch and a major deposition supplier, critical for high-aspect-ratio 3D NAND and GAA logic.Equipment & materials
- 8SK hynixLeading HBM maker and number-two DRAM producer, running 1b/1c-nm-class DRAM processes at Icheon and Cheongju.Manufacture
- 9KLADominant supplier of the wafer and reticle inspection and metrology systems that drive yield at advanced nodes.Equipment & materials
- 10SMICChina's largest foundry and the third-largest worldwide; it makes 7nm-class (N+2) chips with DUV multi-patterning despite export controls.Manufacture
- 11Micron TechnologyThird-largest DRAM maker, first to ship 1-beta DRAM, and building new leading-edge memory fabs in Idaho and New York.Manufacture
- 12Carl Zeiss AGIts ZEISS SMT unit is the sole maker of the EUV and High-NA EUV optics in ASML scanners.Equipment & materials