- Capability group
- Semiconductors & Advanced Computing
- Domain
- Critical Technology · Hard Power
- Identifier
- factbase.org/cap/ZN3NJYQW68
Papers
–
2020–2024
Paper growth
–
2020–24 on 2015–19
Patent families
89.4k
2020–2024
Filed abroad
53%
families in more than one office
In the framework
What the capability covers and what it leaves to others, and the indicators it will be measured by.
Bounds
Covers packaging and integration technology; assembly plants belong to Strategic Infrastructure, and the migration of frontier value into this stage reads across its make and control layers.
Lineage
New in v0.1; added because the performance frontier has moved beyond transistor scaling into integration, and a value-chain structure without this stage would misread where position is now contested.
Indicators
- advanced packaging capacity sharePending
- assembly and test revenue sharePending
Research
No research data maps to this capability yet: it is new in framework v0.1 and the research classification still follows the v0.0 topics.
Patents
Patent families by the nation of origin of their applicants and their earliest priority year, from the CPC and IPC classes the capability is read from. 2025 onwards is incomplete: families are published 18 months after priority.
Families by priority year
The five leading origins, families by year
16,275 applicants filed here in 2015–2024; the five largest held 14% of families (HHI 69 of 10,000: unconcentrated).
Share of families by origin, 2020–2024
- 1China36.8%32,916 families
- 2Japan18.1%16,190 families
- 3South Korea14.6%13,015 families
- 4United States12.1%10,820 families
- 5Taiwan10.3%9,247 families
- 6Germany3.3%2,912 families
- 7Singapore0.9%811 families
- 8France0.8%712 families
- 9Netherlands0.6%532 families
- 10Switzerland0.5%422 families
Applicants filing most internationally, 2015–2024
Families filed in more than one office, by applicant as the offices name them.
- 1SAMSUNG ELECTRONICS CO LTD6,808international families
- 2TAIWAN SEMICONDUCTOR MFG CO LTD4,301international families
- 3SAMSUNG DISPLAY CO LTD2,524international families
- 4INTEL CORP2,029international families
- 5MITSUBISHI ELECTRIC CORP1,644international families
- 6TAIWAN SEMICONDUCTOR MFG1,524international families
- 7BOE TECHNOLOGY GROUP CO LTD1,246international families
- 8MURATA MANUFACTURING CO1,245international families
- 9INFINEON TECHNOLOGIES AG1,169international families
- 10ROHM CO LTD987international families
Classification read
- H10W Semiconductor packages, interposers, bonding, encapsulation and thermal control · 10m documents
- H10B80/00 Stacked and assembled memory packages · 12.3k documents
- H10D80/00 Assemblies of multiple semiconductor devices · 4k documents
Shares inventions with
Capabilities whose classes the same families also fall in, by overlap (Jaccard).
- Advanced Semiconductor Fabrication40,102 families · 0.216
- Semiconductor Equipment & Materials11,734 families · 0.069
- Compound & Power Semiconductors3,648 families · 0.036
- Advanced Imaging & Photonic Sensing2,982 families · 0.021
- Advanced Optical Communication & Photonics2,328 families · 0.018
Companies
50 companies in this capability, across 6 regions. The leading 12:
- 1TSMCRuns the 3DFabric platform (CoWoS, InFO, SoIC) that packages almost every leading AI accelerator, including Nvidia and AMD GPUs, and is the largest holder of advanced-packaging capacity.Manufacture
- 2ASE Technology HoldingThe world's largest OSAT (it includes SPIL), offering fan-out, 2.5D/3D, SiP and its VIPack chiplet-integration platform, and adding CoWoS-type capacity for AI chips.Manufacture
- 3Amkor TechnologyThe second-largest OSAT, supplying 2.5D, fan-out, flip-chip and SiP packaging, and building a CHIPS Act-funded advanced-packaging campus in Peoria, Arizona that will serve Apple and TSMC.Manufacture
- 4IntelDeveloped EMIB and Foveros 3D stacking, led the UCIe chiplet standard and sells advanced packaging as a foundry service from sites in New Mexico, Malaysia and elsewhere.Manufacture
- 5Samsung ElectronicsCombines HBM memory stacking with its I-Cube (2.5D) and X-Cube (3D) foundry packaging, and is the largest international patent applicant in this capability.Manufacture
- 6SK hynixThe leading HBM supplier; its MR-MUF through-silicon-via die stacking is central to AI-accelerator packages, and it is building an advanced-packaging plant in West Lafayette, Indiana.Manufacture
- 7JCET GroupChina's largest OSAT and third worldwide (it owns STATS ChipPAC), with the XDFOI chiplet/2.5D platform in volume production.Manufacture
- 8Applied MaterialsThe largest supplier of wafer-level packaging equipment (deposition, etch, plating, hybrid-bonding tools with BESI), and it runs a dedicated heterogeneous-integration R&D centre.Equipment & materials
- 9BE Semiconductor Industries (Besi)The leading maker of die-attach and hybrid-bonding systems; its tools are used for 3D chip stacking at TSMC, Intel and the memory makers.Equipment & materials
- 10Disco CorporationDominates precision dicing, grinding and thinning equipment, which every HBM stack and 2.5D/3D package depends on.Equipment & materials
- 11Tongfu MicroelectronicsA top-five global OSAT and AMD's main back-end partner (through the former AMD Penang and Suzhou plants), offering chiplet and 2.5D packaging.Manufacture
- 12ASMPTOne of the largest back-end equipment makers, supplying thermo-compression and hybrid bonders for HBM and chiplet assembly as well as die-attach and wire-bonding tools.Equipment & materials