GINC Critical Technology
Capability group

Semiconductors & Advanced Computing

The capacity to design, fabricate, tool, package and compute: the semiconductor value chain end to end, and the high-performance and AI computing built on it.

Domain
Critical Technology · Hard Power
Identifier
factbase.org/cpg/83AEVY1F16
Capabilities
6

Bounds. Holds the technology of the value chain; the fabrication plants, packaging works and computing centres as facilities belong to Strategic Infrastructure, chip trade and industrial outcomes to the economic domains, and control instruments to governance, with the leverage they exercise recorded at this group's control layer. Design tools, fabrication processes, equipment and materials are each held as capacities in their own right because each is a distinct point of national position in one chain.

Capabilities

Semiconductor Design & EDA1W9YVWCN49The capacity to design leading-edge semiconductors and to command the design layer itself, electronic design automation, intellectual-property cores and verification, on which all design depends.Research2.5k papers −0%China 24%Patents22.6k families +75%China 69%Advanced Semiconductor FabricationWPY8136006The capacity to fabricate semiconductors at or near the leading edge: the process technology, yield mastery and production know-how of advanced nodes.Research2.5k papers −0%China 24%Patents147.7k families +18%China 38%Semiconductor Equipment & MaterialsD7FWJJE206The capacity to build the machines and supply the materials that make chipmaking possible: lithography, deposition, etch and metrology equipment, photoresists, wafers and speciality chemicals and gases.Research– papers No research data yetPatents132.4k families +39%China 46%Advanced Packaging & Heterogeneous IntegrationZN3NJYQW68The capacity to assemble, package and integrate semiconductors at the frontier: advanced packaging, chiplet architectures and heterogeneous integration, where system performance is increasingly won.Research– papers No research data yetPatents89.4k families +26%China 37%Compound & Power SemiconductorsH4YJ782F1RThe capacity to develop and produce compound, wide-bandgap and power semiconductors, the device families that carry power electronics, radio frequency and extreme environments.Research27.7k papers +11%China 27%Patents26.3k families +46%China 50%High-Performance & AI ComputingEEFHJ9SJ2QThe capacity to build and operate computing at the frontier: supercomputing, AI training and inference at scale, and the accelerator and system architectures that deliver them.Research31.6k papers +15%United States 26%Patents33.2k families +67%China 54%

The capabilities compared

Papers and patent families, 2020–2024, with growth on the five years before and the leading nation in each.

CapabilityPapersGrowthResearch leaderFamiliesGrowthPatent leader
Semiconductor Design & EDA2.5k−0%China 24%22.6k+75%China 69%
Advanced Semiconductor Fabrication2.5k−0%China 24%147.7k+18%China 38%
Semiconductor Equipment & Materials–––132.4k+39%China 46%
Advanced Packaging & Heterogeneous Integration–––89.4k+26%China 37%
Compound & Power Semiconductors27.7k+11%China 27%26.3k+46%China 50%
High-Performance & AI Computing31.6k+15%United States 26%33.2k+67%China 54%

Research across the group

Papers by year for each capability, and the nations' shares of the group's papers, 2020–2024. A capability that shares a v0.0 topic with another counts it in both.

  1. 1China18.9%12,147 papers
  2. 2United States17.5%11,210 papers
  3. 3India5.4%3,447 papers
  4. 4Japan4.7%3,018 papers
  5. 5Germany4.5%2,888 papers
  6. 6United Kingdom3.1%2,019 papers
  7. 7South Korea3.1%2,003 papers
  8. 8Italy2.5%1,632 papers
  9. 9France2.3%1,454 papers
  10. 10Taiwan1.9%1,204 papers

Patents across the group

Patent families by priority year for each capability, and the origin nations' shares of the group's families, 2020–2024. A family in two capabilities' classes counts in both.

  1. 1China43.7%197,299 families
  2. 2Japan17.4%78,677 families
  3. 3South Korea13.1%59,255 families
  4. 4United States11.4%51,351 families
  5. 5Taiwan7.6%34,508 families
  6. 6Germany2.1%9,282 families
  7. 7Netherlands1.0%4,685 families
  8. 8France0.6%2,935 families
  9. 9Singapore0.5%2,446 families
  10. 10United Kingdom0.4%1,873 families

Companies

228 companies in Semiconductors & Advanced Computing, across 8 regions. The leading 12:

  1. 1ASMLSole supplier of EUV lithography scanners and the leading supplier of DUV immersion scanners, the critical chokepoint tool for leading-edge chipmaking.Equipment & materials
  2. 2Infineon TechnologiesWorld's largest power semiconductor supplier, producing silicon IGBTs/MOSFETs, CoolSiC silicon-carbide devices and CoolGaN (after acquiring GaN Systems in 2023), with a 200mm SiC fab in Kulim, Malaysia.Manufacture
  3. 3NVIDIADominant designer of AI accelerators (Hopper, Blackwell, Rubin GPUs), NVLink/InfiniBand interconnect and the CUDA software stack that power most AI training clusters and leading supercomputers.Design
  4. 4SynopsysLargest EDA and semiconductor IP vendor, covering synthesis, verification and the leading interface IP; it absorbed Ansys simulation in 2025.Software & services
  5. 5TSMCLargest foundry in the world with about two-thirds of foundry revenue; first to volume production at 3nm and 2nm (N2).Manufacture
  6. 6Applied MaterialsWorld's largest wafer fab equipment maker by revenue, leading in deposition (CVD, PVD, epitaxy), ion implant, CMP and e-beam inspection.Equipment & materials
  7. 7ASE Technology HoldingThe world's largest OSAT (it includes SPIL), offering fan-out, 2.5D/3D, SiP and its VIPack chiplet-integration platform, and adding CoWoS-type capacity for AI chips.Manufacture
  8. 8Cadence Design SystemsSecond of the big-three EDA vendors; it leads in custom/analog layout (Virtuoso), hardware emulation (Palladium) and digital implementation, and also sells IP.Software & services
  9. 9onsemiVertically integrated SiC producer (from boule growth in New Hampshire to EliteSiC MOSFETs and modules) and a leading supplier of automotive power devices, with a SiC expansion in Rožnov, Czech Republic.Manufacture
  10. 10Samsung ElectronicsRuns leading-edge logic (first gate-all-around 3nm) and the world's largest DRAM and NAND fabs; tops international patent filings in this capability.Manufacture
  11. 11AMDDesigns EPYC CPUs and Instinct MI300/MI350 accelerators that power the exascale Frontier and El Capitan systems and a growing share of AI clusters.Design
  12. 12Amkor TechnologyThe second-largest OSAT, supplying 2.5D, fan-out, flip-chip and SiP packaging, and building a CHIPS Act-funded advanced-packaging campus in Peoria, Arizona that will serve Apple and TSMC.Manufacture
All 228 in the Companies table →