Sensing, Timing & Navigation

Advanced Imaging & Photonic Sensing

The capacity to see beyond the visible: multispectral and hyperspectral imaging, photonic sensing and the electro-optical technologies that turn light into information.

Capability group
Sensing, Timing & Navigation
Domain
Critical Technology · Hard Power
Identifier
factbase.org/cap/VYG5EBQH28
Reference
Hyperspectral imaging Wikipedia

Papers

48.6k

2020–2024

Paper growth

+19%

2020–24 on 2015–19

Patent families

90.6k

2020–2024

Filed abroad

32%

families in more than one office

In the framework

What the capability covers and what it leaves to others, and the indicators it will be measured by.

Bounds

Covers imaging and photonic sensing technology; intelligence exploitation of imagery belongs to National Security, and photonic components are shared with the connectivity and materials groups.

Lineage

Carried from v0.0 (formerly Multispectral and hyperspectral imaging sensors) with the same identifier, absorbing Photonic sensors (retired): one electro-optical sensing capacity, previously split between an application and a component.

Indicators

  • research publication share in imaging and photonic sensingResearch
  • hyperspectral and electro-optical payloads producedPending

Research

Papers classified to the capability, by year and by the nation of their authors' institutions, 2020–2024. Read from the v0.0 research topics Multispectral and hyperspectral imaging sensors and Photonic sensors.

Papers by year

The five leading nations, papers by year

Share of papers, 2020–2024

Of papers with a known author nation; 24% have none and are left out.

  1. 1China33.8%15,558 papers
  2. 2United States8.8%4,038 papers
  3. 3India6.7%3,069 papers
  4. 4Germany3.1%1,426 papers
  5. 5Japan3.1%1,417 papers
  6. 6Italy3.0%1,370 papers
  7. 7United Kingdom3.0%1,364 papers
  8. 8France2.2%1,022 papers
  9. 9Russia2.0%926 papers
  10. 10Spain2.0%923 papers

Leading institutions, 2020–2024

By fractional count: each paper divided among its authors' institutions.

  1. 1Harbin Institute of Technology266fractional papers
  2. 2Wuhan University of Technology238fractional papers
  3. 3Chinese Academy of Sciences236fractional papers
  4. 4Northeastern University229fractional papers
  5. 5Tianjin University208fractional papers
  6. 6Harbin Engineering University199fractional papers
  7. 7Xidian University193fractional papers
  8. 8Zhejiang University193fractional papers
  9. 9Shenzhen University187fractional papers
  10. 10Huazhong University of Science and Technology187fractional papers

Patents

Patent families by the nation of origin of their applicants and their earliest priority year, from the CPC and IPC classes the capability is read from. 2025 onwards is incomplete: families are published 18 months after priority.

Families by priority year

The five leading origins, families by year

20,520 applicants filed here in 2015–2024; the five largest held 10% of families (HHI 35 of 10,000: unconcentrated).

Share of families by origin, 2020–2024

  1. 1China56.2%50,913 families
  2. 2Japan10.7%9,735 families
  3. 3South Korea10.7%9,703 families
  4. 4United States8.8%8,015 families
  5. 5Germany4.3%3,921 families
  6. 6Taiwan2.3%2,062 families
  7. 7France1.3%1,209 families
  8. 8Switzerland0.6%585 families
  9. 9United Kingdom0.6%510 families
  10. 10Canada0.4%387 families

Applicants filing most internationally, 2015–2024

Families filed in more than one office, by applicant as the offices name them.

  1. 1SONY SEMICONDUCTOR SOLUTIONS CORP3,006international families
  2. 2SAMSUNG ELECTRONICS CO LTD2,309international families
  3. 3CANON KK1,320international families
  4. 4BOSCH GMBH ROBERT978international families
  5. 5PANASONIC IP MAN CO LTD797international families
  6. 6FUJIFILM CORP758international families
  7. 7TAIWAN SEMICONDUCTOR MFG CO LTD674international families
  8. 8HUAWEI TECH CO LTD615international families
  9. 9SONY CORP574international families
  10. 10BOE TECHNOLOGY GROUP CO LTD558international families

Classification read

  • G01J3/00 Spectrometry, including hyperspectral imaging spectrometers · 425.3k documents
  • G01J5/00 Infrared radiation measurement and thermal imaging · 262k documents
  • G01J9/00 Optical phase and wavefront measurement · 19.2k documents
  • G01S17/00 Lidar systems · 429.5k documents
  • G01S7/48 Lidar components and signal processing · 329.4k documents
  • H04N23/20 Infrared cameras · 25.4k documents
  • H04N5/33 Infrared image conversion · 11.5k documents
  • H10F39/00 Image sensors and detector arrays · 862.1k documents
  • H10F30/00 Photodetectors · 86.8k documents
  • G01D5/353 Fibre-optic sensors · 35.8k documents
  • G02B23/12 Night-vision and image-intensifying sights · 8.5k documents

Shares inventions with

Capabilities whose classes the same families also fall in, by overlap (Jaccard).

Companies

50 companies in this capability, across 8 regions. The leading 12:

  1. 1Sony GroupSony Semiconductor Solutions is the world's largest CMOS image sensor maker, with about half of global revenue share, and it is also the top international patent applicant in this capability.Manufacture
  2. 2Samsung ElectronicsSamsung's System LSI division makes ISOCELL CMOS image sensors (including 200 MP sensors) and is the second-largest image sensor supplier worldwide.Manufacture
  3. 3Teledyne TechnologiesTeledyne owns FLIR (thermal imaging), DALSA, e2v, Princeton Instruments and Judson, which makes it the broadest Western supplier of infrared, scientific, space and machine-vision imaging sensors.Manufacture
  4. 4OmniVision (OmniVision Integrated Circuits Group)OmniVision (formerly Will Semiconductor, which acquired the US-founded OmniVision Technologies in 2019) is the third-largest CMOS image sensor vendor, strong in automotive, security and mobile sensors.Design
  5. 5Hamamatsu PhotonicsHamamatsu is the leading maker of photomultiplier tubes, photodiodes, InGaAs and X-ray image sensors and scientific cameras used in research, medical and industrial photonic sensing.Manufacture
  6. 6onsemionsemi leads the automotive image sensor market (the Hyperlux family for ADAS) and supplies industrial and SPAD/SiPM sensors for lidar.Manufacture
  7. 7CanonCanon designs and makes its own CMOS and SPAD image sensors, optics and imaging systems, and it is the third-largest international patent applicant in this capability.Manufacture
  8. 8STMicroelectronicsST is the leading supplier of time-of-flight ranging sensors built on SPAD arrays and makes global-shutter and automotive in-cabin image sensors.Manufacture
  9. 9L3Harris TechnologiesL3Harris builds space electro-optical imaging payloads (including the WorldView Legion telescopes and weather imagers), WESCAM EO/IR turrets and night-vision systems.Integration
  10. 10RTXRaytheon is a major US maker of EO/IR focal-plane arrays, targeting sensors (such as the MTS family) and space-based infrared and visible imaging instruments.Integration
  11. 11SafranSafran Electronics & Defense and Safran Reosc make optronic sights, infrared cameras and large space optics, and Safran co-owns the infrared detector maker Lynred with Thales.Integration
  12. 12ThalesThales is a top European optronics house (Damocles/TALIOS pods, thermal sights), builds Earth-observation optical instruments through Thales Alenia Space and co-owns infrared detector maker Lynred.Integration
All 50 in the Companies table →